Nanofabrication/Equipment/Oxford ICP etching system

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Oxford ICP etching system (2 chambers - 1 loadlock)

Features

PlasmaLab System 100 (Oxford Instruments) located in C122. The system comprises two process stations (Chamber 1 (ICP 180) dedicated to chlorine-based etch chemistry and Process Chamber 3 (ICP 180) dedicated to fluorine-based etch chemistry) and a single automatic load lock / transfer chamber. Process chamber capable for 4" .
  • The gases available for the ICP – Chlorine chamber are: Ar, O2, Cl2, BCl3, CO, SF6, CHF3, and HBr.
  • The gases available for the RIE – Fluorine chamber are: Ar, O2, CF4, CH4, SF6, CHF3, HCFC-124, and H2.
  • For Process Station ICP 180 the typical process operating ranges are:
    • base pressure = 10-6 Torr
    • total gas flows = 10 to 200 sccm
    • pressure = 1 to 60 mT
    • RF power = 5W to 300 W
    • ICP power = 200W to 3000W
    • He pressure = 0 to 30 Torr
    • Temperature = -130oC to 600oC
    • Liquid Nitrogen for temperature control
  • For Process Station RIE the typical process operating ranges are:
    • base pressure = 10-6 Torr
    • total gas flows = 10 to 150 sccm
    • pressure = 5 to 500 mT
    • RF power = 20W to 600 W
    • He pressure = 0 to 30 Torr