Nanofabrication/Equipment/Wafer Dicing Saw

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ADT 7200 Dicing Saw

Wafer Mounting System

Dicing Saw

The ADT7200 Dicing saw is a semiautomatic saw that can cut up from small pieces to a 200mm silicon wafer.

Features

8 Inch Chuck

materials cut: Silicon, Glass, Sapphire, Quartz, STO

User Proposal Feasibility

When requesting the use of this instrument, please provide the following information in your user proposal:

Sample materials
Layout Drawing
Number of samples to process or number of times of instrument usage

Questions? Please contact the instrument custodian before submitting your proposal.

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