Nanofabrication/Equipment/Wafer Dicing Saw

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ADT 7200 Dicing Saw
Wafer Mounting System

Dicing Saw

The ADT7200 Dicing saw is a semiautomatic saw that can cut up from small pieces to a 200mm silicon wafer.


Features

  • 8 Inch Chuck

materials cut: Silicon, Glass, Sapphire, Quartz, STO

Thing to know

  • Each user should know or do the following before cutting or requesting staff assistance in cutting:
  • Substrate thickness and composition.
  • Blue dicing tape thickness: 75 microns (other tape may be a different thickness).
  • Spin thin photoresist layer to protect surface if needed.
  • Index for all angles
  • Where markers are located
  • No GaAs, PZT, or heavy metals are allowed.

Dicing Blades

User Proposal Feasibility

When requesting the use of this instrument, please provide the following information in your user proposal:

  • Sample materials
  • Layout Drawing
  • Number of samples to process or number of times of instrument usage

Questions? Please contact the instrument custodian before submitting your proposal.

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