Nanofabrication/Equipment/Wafer Dicing Saw: Difference between revisions
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[[File:IMG 0955.JPG|right|400px| ADT 7200 Dicing Saw]] | [[File:IMG 0955.JPG|right|400px| ADT 7200 Dicing Saw]] | ||
[[File:IMG 0956.JPG|right|400px| | [[File:IMG 0956.JPG|right|400px|Wafer Mounting System]] | ||
==Dicing Saw== | ==Dicing Saw== | ||
Revision as of 20:51, November 23, 2020
Dicing Saw
Features
- 8 Inch Chuck
materials cut: Silicon, Glass, Sapphire, Quartz, STO
User Proposal Feasibility
When requesting the use of this instrument, please provide the following information in your user proposal:
- Sample materials, shapes, and sizes
- Information about the intended patterns (shapes, sizes, distances, area coverage)
- Number of samples to process or number of times of instrument usage
Questions? Please contact the instrument custodian before submitting your proposal.