Nanofabrication/Equipment/Wafer Dicing Saw: Difference between revisions
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==Dicing Saw== | ==Dicing Saw== | ||
The ADT7200 Dicing saw is a semiautomatic saw that can cut up from small pieces to a 200mm silicon wafer. | |||
Revision as of 20:08, November 24, 2020
Dicing Saw
The ADT7200 Dicing saw is a semiautomatic saw that can cut up from small pieces to a 200mm silicon wafer.
Features
- 8 Inch Chuck
materials cut: Silicon, Glass, Sapphire, Quartz, STO
User Proposal Feasibility
When requesting the use of this instrument, please provide the following information in your user proposal:
- Sample materials
- Layout Drawing
- Number of samples to process or number of times of instrument usage
Questions? Please contact the instrument custodian before submitting your proposal.