Nanofabrication/Equipment/Wafer Dicing Saw: Difference between revisions
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When requesting the use of this instrument, please provide the following information in your user proposal: | When requesting the use of this instrument, please provide the following information in your user proposal: | ||
* Sample materials | * Sample materials | ||
* | * Layout Drawing | ||
* Number of samples to process or number of times of instrument usage | * Number of samples to process or number of times of instrument usage | ||
Questions? Please contact the instrument custodian before submitting your proposal. | Questions? Please contact the instrument custodian before submitting your proposal. | ||
Revision as of 20:53, November 23, 2020
Dicing Saw
Features
- 8 Inch Chuck
materials cut: Silicon, Glass, Sapphire, Quartz, STO
User Proposal Feasibility
When requesting the use of this instrument, please provide the following information in your user proposal:
- Sample materials
- Layout Drawing
- Number of samples to process or number of times of instrument usage
Questions? Please contact the instrument custodian before submitting your proposal.