Nanofabrication/Equipment/Wafer Dicing Saw: Difference between revisions

Latest revision as of 00:40, January 29, 2021

The ADT7200 Dicing saw is a semiautomatic saw that can cut up from small pieces to a 200mm silicon wafer.

materials cut: Silicon, Glass, Sapphire, Quartz, STO

Each user should know or do the following before cutting or requesting staff assistance in cutting:
Substrate thickness and composition.
Blue dicing tape thickness: 75 microns (other tape may be a different thickness).
Spin thin photoresist layer to protect surface if needed.
Index for all angles
Where markers are located
No GaAs, PZT, or heavy metals are allowed.

When requesting the use of this instrument, please provide the following information in your user proposal:

Questions? Please contact the instrument custodian before submitting your proposal.

@@ Line 1: / Line 1: @@
-<gallery>
-IMG 0956.JPG |Wafer Mounting System
-Example.jpg|Caption2
+ [[File:IMG 0955.JPG|right|400px| ADT 7200 Dicing Saw]]
-</gallery>
+ [[File:IMG 0956.JPG|right|400px|Wafer Mounting System]]
+==Dicing Saw==
+The ADT7200 Dicing saw is a semiautomatic saw that can cut up from small pieces to a 200mm silicon wafer.
+===Features===
+* 8 Inch Chuck
+materials cut: Silicon, Glass, Sapphire, Quartz, STO
+===Thing to know===
+* Each user should know or do the following before cutting or requesting staff assistance in cutting:
+* Substrate thickness and composition.
+* Blue dicing tape thickness: 75 microns (other tape may be a different thickness).
+* Spin thin photoresist layer to protect surface if needed.
+* Index for all angles
+* Where markers are located
+* No GaAs, PZT, or heavy metals are allowed.
+===Dicing Blades===
+===User Proposal Feasibility===
+When requesting the use of this instrument, please provide the following information in your user proposal:
+* Sample materials
+* Layout Drawing
+* Number of samples to process or number of times of instrument usage
+Questions? Please contact the instrument custodian before submitting your proposal.