Scanning probe detector channel descriptions: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| Line 3: | Line 3: | ||
'''Some common definitions of 26ID scan detector channels'''<br /> | '''Some common definitions of 26ID scan detector channels'''<br /> | ||
<br /> | <br /> | ||
{| {{table}} style="text-align: | {| {{table}} style="text-align:left" | ||
| align="center" style="background:#f0f0f0;"|'''Detector Channel number''' | | align="center" style="background:#f0f0f0;"|'''Detector Channel number''' | ||
| align="center" style="background:#f0f0f0;"|'''EPICS Process variable''' | | align="center" style="background:#f0f0f0;"|'''EPICS Process variable''' | ||
| Line 65: | Line 65: | ||
| D26 ||26id:BLEPS:XTAL_TEMP_02:RBV ||DCM second crystal temperature - typically -171 deg F | | D26 ||26id:BLEPS:XTAL_TEMP_02:RBV ||DCM second crystal temperature - typically -171 deg F | ||
|- | |- | ||
| D27 ||26idctsrc:bpmds:current:total ||Alternate I0 - integrated intensity on all four quadrant diodes at the front of C Hutch - mono beam intensity measurement does not depend on NES slit settings or exposure times | | D27 ||26idctsrc:bpmds:current:total ||Alternate I0 - integrated intensity on all four quadrant diodes at the front of C Hutch - mono beam intensity measurement that does not depend on NES slit settings or exposure times | ||
|- | |- | ||
| D28 ||26idctsrc:bpmds:pos:x ||Approximate X (horizontal) position of mono beam in microns at the front of C hutch - related to mirror piezo and DCM chi2 stability | | D28 ||26idctsrc:bpmds:pos:x ||Approximate X (horizontal) position of mono beam in microns at the front of C hutch - related to mirror piezo and DCM chi2 stability | ||
Revision as of 18:31, September 10, 2010
Back to Scanning Probe Diffraction Quick Reference
Some common definitions of 26ID scan detector channels
| Detector Channel number | EPICS Process variable | Description |
| D01 | 26idsclr1:scaler1.S1 | I0 - Integrated Ion chamber current after NES slits (change current amplification via yellow SR570 tab on main beamline screen) |
| D02 | 26idcXMAP:mca5.R1 | Bi - Fluorescence channel from outboard detector, summed ROI#1 - find and modify with MCA software from User Tools tab on main beamline screen |
| D03 | 26idcXMAP:mca5.R2 | Ti - Fluorescence channel from outboard detector, summed ROI#2 - find and modify with MCA software from User Tools tab on main beamline screen |
| D04 | 26idcXMAP:mca5.R5 | Fe - Fluorescence channel from outboard detector, summed ROI#5 - find and modify with MCA software from User Tools tab on main beamline screen |
| D05 | 26id:ccd.R01.Average | Integrated Intensity/Num Pixels for CCD ROI#1 - ROI#1 defines the total active chip area to be saved, so this is the total CCD intensity per pixel |
| D06 | 26id:ccd.R02.Average | Integrated Intensity/Num Pixels for CCD ROI#2 - usually tightly defined around the outgoing beam - Contrast here is related to diffracting volume |
| D07 | 26id:ccd.R02.XCentroid | X center of mass of intensity in CCD ROI#2 - This is related to lattice strain and rotation in the diffraction plane, scales away from center of ROI2 with signal/dark current |
| D08 | 26id:ccd.R02.YCentroid | Y center of mass of intensity in CCD ROI#2 - This is related to lattice rotation out of the diffraction plane, scales away from center of ROI2 with signal/dark current |
| D09 | 26idcDET:userCalc3.VAL | R02.Average - R03.Average, Background subtracted average intensity - ROI#3 typically set around an unused area, this is useful for viewing scans in progress with low contrast |
| D10 | 26idcDET:userCalc6.VAL | CCD Image number - If you are using the CCD DO NOT MODIFY THIS CHANNEL - Necessary for Matlab analysis routines |
| D11 | 26idctsrc:DMM1:Ch1_raw.VAL | Channel 1 - C Hutch digital multimeter - FOMX temperature |
| D12 | 26idctsrc:DMM1:Ch2_raw.VAL | Channel 2 - C Hutch digital multimeter - FOMY temperature |
| D13 | 26idctsrc:DMM1:Ch3_raw.VAL | Channel 3 - C Hutch digital multimeter - FOMZ temperature |
| D14 | 26idctsrc:DMM1:Ch4_raw.VAL | Channel 4 - C Hutch digital multimeter - SAMX temperature |
| D15 | 26idctsrc:DMM1:Ch5_raw.VAL | Channel 5 - C Hutch digital multimeter - SAMY temperature |
| D16 | 26idctsrc:DMM1:Ch6_raw.VAL | Channel 6 - C Hutch digital multimeter - SAMZ temperature |
| D17 | 26idctsrc:DMM1:Ch7_raw.VAL | Channel 7 - C Hutch digital multimeter - SAM Theta temperature |
| D18 | 26idpvc:userStringCalc3.VAL | Time of day - Units are fractional hours (ie 22.5 = 10:30pm) - use min and max of a linear scan to accurately estimate 2D scanning times, discontinuity in this channel indicates a hung scan |
| D19 | - | - |
| D20 | - | - |
| D21 | B26ID-CG-DCM-01:PFEED | Feed pressure of LN2 cryocooler internal circuit - spikes at refill, adjust fill cycle levels and remove ice from vent line to minimize this |
| D22 | B26ID-CG-DCM-01:MNLEV | Cryocooler main vessel LN2 level - level of external unpressurized LN2 bath, this activates the fill cycle, dewar currently is kept between 80-60% full |
| D23 | 26id:BLEPS:MIRROR TEMP 01:RBV | First mirror temperature - RTD readout - useful to monitor equilibration after a beam dump |
| D24 | 26id:BLEPS:MIRROR TEMP 02:RBV | Second mirror temperature |
| D25 | 26id:BLEPS:XTAL_TEMP_01:RBV | DCM first crystal temperature - typically -234 deg F |
| D26 | 26id:BLEPS:XTAL_TEMP_02:RBV | DCM second crystal temperature - typically -171 deg F |
| D27 | 26idctsrc:bpmds:current:total | Alternate I0 - integrated intensity on all four quadrant diodes at the front of C Hutch - mono beam intensity measurement that does not depend on NES slit settings or exposure times |
| D28 | 26idctsrc:bpmds:pos:x | Approximate X (horizontal) position of mono beam in microns at the front of C hutch - related to mirror piezo and DCM chi2 stability |
| D29 | 26idctsrc:bpmds:pos:y | Approximate Y (vertical) position of mono beam in microns measured at the front of C hutch - primarily related to DCM theta2 stability |
| D30 | S:SRcurrentAI | Alternate I0 - APS storage ring current value, useful for normalizing long scan data when the ring is not in top-up mode - unexpected changes of this value indicate orbit/steering loss or beam dump |
| D31 | B26ID-CG-DCM-01:PFEED | Feed pressure of LN2 cryocooler internal circuit - spikes at refill, adjust fill cycle levels and remove ice from vent line to minimize this |
| D32 | B26ID-CG-DCM-01:MNLEV | Cryocooler main vessel LN2 level - level of external unpressurized LN2 bath, this activates the fill cycle, dewar currently is kept between 80-60% full |
| D33 | 26id:BLEPS:MIRROR TEMP 01:RBV | First mirror temperature - RTD readout - useful to monitor equilibration after a beam dump |
| D34 | 26id:BLEPS:MIRROR TEMP 02:RBV | Second mirror temperature |
| D35 | 26id:BLEPS:XTAL_TEMP_01:RBV | DCM first crystal temperature - typically -234 deg F |
| D36 | 26id:BLEPS:XTAL_TEMP_02:RBV | DCM second crystal temperature - typically -171 deg F |
| D37 | 26idctsrc:bpmds:current:total | Alternate I0 - integrated intensity on all four quadrant diodes at the front of C Hutch - mono beam intensity measurement does not depend on NES slit settings or exposure times |
| D38 | 26idctsrc:bpmds:pos:x | Approximate X (horizontal) position of mono beam in microns at the front of C hutch - related to mirror piezo and DCM chi2 stability |
| D39 | 26idctsrc:bpmds:pos:y | Approximate Y (vertical) position of mono beam in microns measured at the front of C hutch - primarily related to DCM theta2 stability |
| D40 | S:SRcurrentAI | Alternate I0 - APS storage ring current value, useful for normalizing long scan data when the ring is not in top-up mode - unexpected changes of this value indicate orbit/steering loss or beam dump |