View source for Nanofabrication/Equipment/Wafer Dicing Saw


 
 [[File:IMG 0955.JPG|right|400px| ADT 7200 Dicing Saw]]
 [[File:IMG 0956.JPG|right|400px|Wafer Mounting System]]
 
==Dicing Saw==

The ADT7200 Dicing saw is a semiautomatic saw that can cut up from small pieces to a 200mm silicon wafer.


===Features===
* 8 Inch Chuck
materials cut: Silicon, Glass, Sapphire, Quartz, STO

===Thing to know===
* Each user should know or do the following before cutting or requesting staff assistance in cutting:
* Substrate thickness and composition.
* Blue dicing tape thickness: 75 microns (other tape may be a different thickness).
* Spin thin photoresist layer to protect surface if needed.
* Index for all angles
* Where markers are located
* No GaAs, PZT, or heavy metals are allowed.

===Dicing Blades===



===User Proposal Feasibility===

When requesting the use of this instrument, please provide the following information in your user proposal:

* Sample materials 
* Layout Drawing
* Number of samples to process or number of times of instrument usage

Questions? Please contact the instrument custodian before submitting your proposal.